Thirty-fourth International Symposium for Testing and Failure Analysis

Thirty-fourth International Symposium for Testing and Failure Analysis

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A.Mercury On gold wire bonded products, the gold bond can be removed by mercury. ... Inter-metallic compound coverage is an index used to judge the bonding performance. ... But eventually two more pads appeared cracked after 180s.


Title:Thirty-fourth International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher:ASM International - 2008-01-01
ISBN-13:

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